The positioning of the SPI solder paste detector equipment is a quality control and analysis tool. Although it detects the height, volume, area, short circuit and offset of the solder paste, its detection data is more important. The SPI equipment provides quality control personnel with analysis data of the inspection content, so that the changing trend and law of the inspection content such as the height and volume of the solder paste can be obtained from the data, so that the equipment can be adjusted before printing to reduce the defect rate. What are the capabilities of the solder paste inspection machine? Can you check out those solder paste printing defects? Well, let’s take a look at what the "SPI solder paste inspection machine" can do for us? Can you help us check out the defects of solder paste printing? Please note that the solder paste inspection machine can only perform image inspection on the surface. If there is an area covered by an object, it cannot be inspected. However, the timing of use of the solder paste inspection machine should be before the parts are placed, so it should No solder paste will be covered. The solder paste inspection machine can measure the following data: ▪ Solder paste printing volume ▪ The height of solder paste printing ▪ The area/volume of solder paste printing ▪ The flatness of solder paste printing ▪ Make SPC statistics to measure process capability In addition, the solder paste inspection machine can detect the following defects: ▪ Whether the solder paste printing is shifted (shift) ▪ Whether the solder paste printing has a height deviation (pointing) ▪ Whether solder paste printing is bridged (Bridge) ▪ Whether the solder paste printing is defective or damaged It’s just that the machine is the machine, and the human is the key. SPI is a set of tools. If used well, it can help improve product quality, thereby increasing production and reducing costs. Affect output.
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