X-RAY Nondestructive Testing X-ray (hereinafter referred to as X-Ray) uses a cathode ray tube to generate high-energy electrons to collide with a metal target. During the collision, the electrons suddenly decelerate, and the kinetic energy lost will be in the form of X-Ray It emits, which has a very short wavelength but high electromagnetic radiation. For locations where the sample cannot be inspected by appearance, the change in light intensity after X-Ray penetrates materials of different densities is recorded, and the resulting contrast effect can form an image to show the internal structure of the object to be tested. Observe the problematic area inside the test object when the test object is destroyed. X-ray detection is to detect the alignment between the positive electrode and the negative electrode of the battery, that is, at least the negative electrode is required to cover the positive electrode to avoid partial lithium precipitation and safety problems; the detection equipment is radioactive, but the equipment is protected and isolated, and All require safety certification, the door is closed when the line is launched, and can be used with confidence; the detection process is like taking an X-ray, and the image is read through transmission; What are the X-ray inspection items? X-rays use a cathode ray tube to generate high-energy electrons, causing them to collide with a metal target. During the collision, due to the sudden deceleration of electrons, the lost kinetic energy will be released in the form of X-rays. As for the position where the sample cannot be observed in appearance, the contrast effect produced by X-rays penetrating materials of different densities can be used to form an image. The image can show the internal structure of the object to be tested, and when the test object is destroyed, Observe the problem area inside the test subject. Test items: 1. Defect inspection in IC packaging, such as: stripping, crack, cavity and integrity inspection of bonding. 2. Defects that may occur in the printed circuit board manufacturing process, such as: poor alignment or bridging and open circuit. 3. SMT solder joint cavity (cavity) phenomenon detection and measurement (measuration). 4. Defect inspection of open circuit (open), short circuit (short) or abnormal connection that may occur in various connection lines. 5. Integrity inspection of solder balls in solder ball array packaging and chip-on-chip packaging. 6. Inspection of high-density plastic material rupture (plastic burst) or metal material cavity (metal cavity). 7. Dimensional measurement, wire arc measurement, and solder area ratio measurement of components.
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