Spi solder paste detection and working principle

SPI (Solder Paste Inspection) refers to the solder paste inspection system. Its main function is to detect the quality of solder paste printing, including volume, area, height, XY offset, shape, bridge, etc. How to detect extremely tiny solder paste quickly and accurately, generally adopts the detection principles of PMP (Chinese translation for phase modulation profile measurement technology) and Laser (Chinese translation for laser triangulation technology).

1. According to statistics, the introduction of SPI can effectively reduce the unqualified rate of the original finished PCB by more than 85%; the cost of repair and scrapping can be greatly reduced by more than 90%, and the quality of the manufactured products has been significantly improved. The joint use of SPI and AOI, through real-time feedback and optimization of the smt patch proofing production line, can make the production quality more stable, greatly shorten the unstable trial production stage that must be experienced when new products are introduced, and save the corresponding cost loss.

2. It can greatly reduce the misjudgment rate of AOI regarding soldering tin, thereby increasing the straight-through rate, and effectively saving the manpower and time cost of human error correction. According to statistics, 74% of the unqualified parts of the current finished PCB are directly related to solder, and 13% are indirectly related. SPI effectively makes up for the shortcomings of traditional detection methods through 3D detection methods

3. Some PCB components such as BGA, CSP, PLCC chips, etc., due to the light shielding caused by their own characteristics, AOI cannot detect them after reflow. And SPI, through process control, minimizes the defects of these devices after the furnace.

4. With the trend of increasingly sophisticated electronic products and lead-free solder, SMD components are becoming more and more miniaturized. Therefore, the quality of solder paste printing is becoming more and more important. SPI can effectively ensure good solder paste printing quality and greatly reduce the possible defective rate of finished products.

5. As a means of quality process control, it can find hidden quality hazards in time before reflow soldering, so there is almost no possibility of repairing costs and scrapping, which effectively saves costs.